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A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs.
Rashid Rashidzadeh
Esrafil Jedari
Tareq Muhammad Supon
Vladimir Mashkovtsev
Published in:
ITC (2015)
Keyphrases
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closed form
mathematical model
low cost
optimization method
solution space
linear equations
learning algorithm
test data
gallium arsenide