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Influence of underfill materials on the reliability of coreless flip chip package.
Chun-Chih Chuang
Tsung-Fu Yang
Jin-Ye Juang
Yin-Po Hung
Chau-Jie Zhan
Yu-Min Lin
Ching-Tsung Lin
Pei-Chen Chang
Tao-Chih Chang
Published in:
Microelectron. Reliab. (2008)
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