Innovative Solutions and Applications of 5G Smart Factory for Chip Packaging.

Cheng Li Na Lu Yang Li Yao Wei Ning Jin

Published in: IWCMC (2023)

Keyphrases

innovative solutions
high density
high speed
open innovation
low cost
analog vlsi
neural network
programmable logic
high bandwidth
smart grid
low power
production line
chip design
manufacturing process
production scheduling
data center
power system
case study
data sets