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Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging.
Florian Merget
M. Ackermann
B. Shen
G. D. Saunders
S. Haag
M. Wolz
Jeremy Witzens
Published in:
ECOC (2021)
Keyphrases
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image processing
integrated circuit
scale invariant
high density
printed circuit boards
scale space
decision trees
software components
small scale