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Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C.

Qingyun XieMengyang YuanJohn NiroulaBejoy SikderShisong LuoKai FuNitul S. RajputAyan Biswas PrantaPradyot YadavYuji ZhaoNadim ChowdhuryTomás Palacios
Published in: VLSI Technology and Circuits (2023)
Keyphrases
  • high temperature
  • logical framework
  • main contribution
  • theoretical framework
  • case study
  • data model
  • cost effective
  • computer aided
  • mobile devices
  • object oriented
  • rapid development
  • dynamic epistemic logic