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Thermal resistance investigations on new leadframe-based LED packages and boards.

B. PardoA. GasseA. FargeixJiri JakovenkoRobert J. WerkhovenXavier PerpiñàXavier JordàMiquel VellvehíT. Van WeeldenP. Bancken
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • solder ball connect
  • infrared
  • database
  • data sets
  • decision making
  • evolutionary algorithm
  • power plant
  • software packages
  • finite element analysis