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Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration.

Jinwoo KimVenkata Chaitanya Krishna ChekuriNael Mizanur RahmanMajid Ahadi DolatsaraHakki Mert TorunMadhavan SwaminathanSaibal MukhopadhyaySung Kyu Lim
Published in: ICCD (2020)
Keyphrases
  • high speed
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  • heterogeneous databases
  • information integration
  • distributed heterogeneous
  • neural network
  • data integration
  • resource usage