Thermal-Aware Design and Test Techniques for Two-and Three-Dimensional Networks-on-Chip.

Kanchan Manna Santanu Chattopadhyay Indranil Sengupta

Published in: ISVLSI (2016)

Keyphrases

three dimensional
design process
single chip
circuit design
low cost
network design
evolvable hardware
software engineering
virtual reality
physical design
vlsi implementation
modular design
chip design