Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging.
Yuanxing PanFei LiHu HeJunhui LiWenhui ZhuPublished in: Microelectron. Reliab. (2017)
Keyphrases
- computer vision
- maximum likelihood
- initial conditions
- infrared
- integrated circuit
- maximum likelihood estimation
- input parameters
- neural network
- high speed
- design process
- sensitivity analysis
- defect detection
- real time
- behavior patterns
- finite element analysis
- measured data
- high density
- human behavior
- expectation maximization
- case study