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Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression.

Hideaki TsuchiyaNaohito SuzumuraRyuji ShibataHideki AonoMakoto OgasawaraToshihiko AkibaKenji SakataKazuyuki NakagawaTakuo Funaya
Published in: IRPS (2019)
Keyphrases
  • electron microscopy
  • mechanical properties
  • database
  • cooperative
  • root cause
  • failure detection
  • real time
  • data mining
  • machine learning
  • computer vision
  • image processing
  • case study
  • computational complexity
  • failure rate