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Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration.
Fumiki Kato
Katsuya Kikuchi
Hiroshi Nakagawa
Masahiro Aoyagi
Published in:
3DIC (2011)
Keyphrases
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hot spots
thermal conductivity
high speed
information integration
power consumption
image processing
edge detection
high precision
data acquisition