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Analytical Reliability Analysis of 3D NoC under TSV Failure.

Misagh KhayambashiPooria M. YaghiniAshkan EghbalNader Bagherzadeh
Published in: ACM J. Emerg. Technol. Comput. Syst. (2015)
Keyphrases
  • reliability analysis
  • routing algorithm
  • network on chip
  • neural network
  • multi processor
  • case based reasoning
  • business intelligence
  • condition monitoring