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A 256 Gbps Heterogeneously Integrated Silicon Photonic Microring-based DWDM Receiver Suitable for In-Package Optical I/O.

Zhe XuanGanesh BalamuruganDuanni HuangRanjeet KumarJahnavi SharmaCooper LevyJinyong KimChaoxuan MaGuan-Lin SuSongtao LiuXinru WuTolga AcikalinHaisheng RongJames E. Jaussi
Published in: VLSI Technology and Circuits (2023)
Keyphrases
  • physical characteristics
  • input output
  • high speed
  • main memory
  • software package
  • real time
  • three dimensional
  • low cost
  • silicon dioxide