Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives.
Byeung-Gee KimSang-Mok LeeYun-Song JoSun-Chul KimKyoung-Moo HarrYoung-Ho KimPublished in: Microelectron. Reliab. (2011)
Keyphrases
- highly reliable
- high speed
- climbing robot
- cmos image sensor
- cmos technology
- low power
- image sensor
- ultra low power
- low cost
- degrees of freedom
- single chip
- coarse to fine
- human body
- motion planning
- silicon on insulator
- human motion
- circuit design
- solid state
- web services composition
- mechanical properties
- physical design
- electron microscopy
- analog vlsi
- programmable logic
- real time
- vlsi implementation
- mixed signal
- parallel robot
- image acquisition
- computer vision
- parallel processing
- high density