A thermal estimation model for 3D IC using liquid cooled microchannels and thermal TSVs.
Surajit Kumar RoySupriyo MandalChandan GiriHafizur RahamanPublished in: VLSI-SoC (2015)
Keyphrases
- mathematical model
- infrared
- probabilistic model
- objective function
- theoretical analysis
- computational model
- prior knowledge
- statistical model
- parameter estimation
- theoretical framework
- maximum likelihood estimation
- genetic algorithm
- parametric models
- estimation algorithm
- neural network model
- management system
- probability distribution
- artificial neural networks
- similarity measure
- high level
- decision making