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Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique.

Jun-Ku KimChang-Wook Baek
Published in: IEICE Electron. Express (2013)
Keyphrases
  • integrated circuit
  • semiconductor manufacturing
  • high density
  • sensor networks
  • massively parallel
  • sensor data
  • semiconductor devices
  • si sio
  • real time
  • low cost