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Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique.
Jun-Ku Kim
Chang-Wook Baek
Published in:
IEICE Electron. Express (2013)
Keyphrases
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integrated circuit
semiconductor manufacturing
high density
sensor networks
massively parallel
sensor data
semiconductor devices
si sio
real time
low cost