Investigation of localized thermal vias for temperature reduction in 3D multicore processors.
Piotr ZajacMelvin GaliciaCezary MajAndrzej NapieralskiPublished in: MIXDES (2015)
Keyphrases
- multicore processors
- thermal imaging
- high temperature
- computing power
- room temperature
- thermal conductivity
- operating system
- infrared
- heat transfer
- parallel architectures
- air temperature
- integrated circuit
- highly parallel
- parallel algorithm
- high density
- efficient implementation
- computing systems
- high end
- parallel programming
- distributed systems
- computer systems