Sign in

Design Concept for Radiation-Hardening of Triple Modular Redundancy TSPC Flip-Flops.

Oliver SchrapeMarko S. AndjelkovicAnselm BreitenreiterAlexey BalashovMilos Krstic
Published in: DSD (2020)
Keyphrases
  • neural network
  • design process
  • infrared
  • case study
  • pattern recognition
  • relational databases
  • image analysis
  • power consumption
  • machine vision
  • intelligent control