The influence of solder composition on the impact strength of lead-free solder ball grid array joints.
H. TsukamotoT. NishimuraS. SuenagaStuart D. McDonaldKeith W. SweatmanKazuhiro NogitaPublished in: Microelectron. Reliab. (2011)
Keyphrases
- mechanical properties
- high temperature
- printed circuit boards
- main factors
- failure rate
- factors that influence
- factors influencing
- semiconductor devices
- real time
- vision system
- distributed computing
- virtual organization
- body parts
- degrees of freedom
- experimental data
- human body
- d objects
- influencing factors
- information technology
- database