The optimization design of bump interconnections in flip chip packages from the electrical standpoint.

De-Shin Liu Chin-Yu Ni

Published in: Microelectron. Reliab. (2002)

Keyphrases

circuit design
optimal design
design principles
printed circuit boards
case study
low cost
computer aided
optimization method
chip design
high density
power transmission
electronic circuits
power grid
physical design
design process
optimization algorithm
optimization problems
evolutionary algorithm