Chin-Yu Ni

Publication Activity (10 Years)

Years Active: 2002-2002
Publications (10 Years): 0

Publications

De-Shin Liu, Chin-Yu Ni
The optimization design of bump interconnections in flip chip packages from the electrical standpoint. Microelectron. Reliab. 42 (12) (2002)
De-Shin Liu, Chin-Yu Ni
A thermo-mechanical study on the electrical resistance of aluminum wire conductors. Microelectron. Reliab. 42 (3) (2002)
Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen
Procedure for design optimization of a T-cap flip chip package. Microelectron. Reliab. 42 (12) (2002)