Yield improvement of 3D ICs in the presence of defects in through signal vias.

Rajeev K. Nain Shantesh Pinge Malgorzata Chrzanowska-Jeske

Published in: ISQED (2010)

Keyphrases

signal processing
frequency domain
significant improvement
integrated circuit
data sets
non stationary
artificial intelligence
high density
compressive sensing
databases
defect detection
real time
learning algorithm
image sequences
feature extraction
impulse response