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Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects.
Edward J. Yarmchuk
Christopher W. Cline
Dominic C. Bruen
Published in:
IBM J. Res. Dev. (2005)
Keyphrases
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multichip module
high reliability
power distribution
high precision
low cost
latent variables
low overhead
defect detection
real time
drug discovery
neural network
image analysis
high speed
artificial neural networks
cervical cancer
high accuracy
fuzzy logic
low power
image segmentation
fiber optic