Vertical Signal Transmission in Three-Dimensional Integrated Circuits by Capacitive Coupling.
Stefan A. KühnMichael B. KleinerRoland ThewesWerner WeberPublished in: ISCAS (1995)
Keyphrases
- integrated circuit
- three dimensional
- direct sequence spread spectrum
- electron microscope
- signal processing
- video signals
- frequency domain
- d objects
- electron beam
- multi view
- x ray
- high frequency
- signal detection
- image analysis
- modulation scheme
- image sequences
- original signal
- data transmission
- surface reconstruction
- digital camera
- range images
- image processing