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Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding.
Masanori Usui
Toshikazu Satoh
Hidehiko Kimura
S. Tajima
Y. Hayashi
D. Setoyama
Masashi Kato
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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high temperature
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