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Impact of ground solder ball failure in BGA package on near electric field radiation.

Yidong YuanTianmeng ZhangZiren WangKaixuan SongLingyu BiLu TianJinchun Gao
Published in: IEICE Electron. Express (2022)
Keyphrases
  • electric field
  • failure rate
  • x ray
  • infrared
  • information systems
  • failure prediction
  • space charge
  • data sets
  • printed circuit boards
  • high impact
  • mechanical properties
  • definite clause
  • component failures