A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages.
Seung-Mo NohSeungkyu KimSeo-Yoon LeeKee-Won KwonPublished in: ICEIC (2024)
Keyphrases
- power dissipation
- high speed
- power consumption
- low power
- monitoring system
- cmos technology
- digital signal processing
- multi dimensional
- power reduction
- real time
- logic circuits
- circuit design
- phase locked loop
- analog circuits
- dimensional data
- finite state machines
- data sets
- digital circuits
- intensive care
- fault diagnosis