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Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias.

Alain FourmigueGiovanni BeltrameGabriela Nicolescu
Published in: DATE (2014)
Keyphrases
  • heat transfer
  • high density
  • steady state
  • high speed
  • real time
  • low cost
  • mathematical model
  • computationally expensive
  • numerical simulations
  • genetic algorithm
  • cost effective
  • mathematical models