Substrate Topological Routing for High-Density Packages.
Shenghua LiuGuoqiang ChenTom Tong JingLei HeTianpei ZhangRobi DuttaXianlong HongPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2009)
Keyphrases
- high density
- magnetic recording
- low density
- close proximity
- high power
- thin film
- data center
- ad hoc networks
- routing protocol
- routing algorithm
- network topology
- routing problem
- topological properties
- high bandwidth
- magnetic tape
- switched networks
- software packages
- inter domain
- film thickness
- network topologies
- fault tolerant
- shortest path
- state space
- databases