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Pb-free high temperature solders for power device packaging.
Yasushi Yamada
Yoshikazu Takaku
Yuji Yagi
Y. Nishibe
Ikuo Ohnuma
Yuji Sutou
R. Kainuma
Kiyohito Ishida
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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high temperature
mechanical properties
power consumption
image sequences
high speed
boundary conditions