Ikuo Ohnuma

Publication Activity (10 Years)

Years Active: 2006-2007
Publications (10 Years): 0

Publications

Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Ikuo Nakagawa, Takashi Atsumi, Mikio Shirai, Ikuo Ohnuma, Kiyohito Ishida
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. Microelectron. Reliab. 47 (12) (2007)
Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Y. Nishibe, Ikuo Ohnuma, Yuji Sutou, R. Kainuma, Kiyohito Ishida
Pb-free high temperature solders for power device packaging. Microelectron. Reliab. 46 (9-11) (2006)