Login / Signup
Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via.
Meng Zhang
Jian Yang
Yurong He
Fan Yang
Fuhua Yang
Guowei Han
Chaowei Si
Jin Ning
Published in:
Sensors (2019)
Keyphrases
</>
sensor networks
low cost
multi sensor
sensor data
high speed
data fusion
high density
real time
sensory data
sensor technology
search engine
database systems
relational databases
mobile devices
sensor readings
sensor measurements