Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.
K. K. JinkaA. DasguptaS. GanesanS. LingPublished in: Microelectron. Reliab. (2009)
Keyphrases
- real time
- low cost
- high speed
- computer systems
- cost effective
- key technologies
- rapid development
- wire bonding
- technological change
- cmos technology
- complex environments
- data processing
- case study
- learning community
- virtual world
- space variant
- evolutionary algorithm
- programmable logic
- analog vlsi
- control center
- information technology