K. K. Jinka

Publication Activity (10 Years)

Years Active: 2007-2009
Publications (10 Years): 0

Publications

K. K. Jinka, A. Dasgupta, S. Ganesan, S. Ling
Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires. Microelectron. Reliab. 49 (5) (2009)
K. K. Jinka, S. Ganesan, A. Dasgupta, S. Ling, Andrew A. Shapiro, D. Schatzel
Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips. Microelectron. Reliab. 47 (8) (2007)