Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor.
Yunfan ZhangBowen LiHui LiShengnan ShenFeng LiWentao NiWan CaoPublished in: Sensors (2021)
Keyphrases
- infrared
- sensor data
- sensor networks
- multi sensor
- infrared sensors
- shear stress
- power plant
- mobile robot
- real time
- finite element analysis
- high temperature
- finite element
- power consumption
- electro optical
- analog to digital converter
- vision sensor
- thermal images
- visible spectrum
- sensor readings
- sensor fusion
- data acquisition
- expert systems
- case study
- databases