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Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking.

Sung Chul HongWang Gu LeeWon Joong KimJong Hyeong KimJae Pil Jung
Published in: Microelectron. Reliab. (2011)
Keyphrases
  • high speed
  • low power
  • metal oxide
  • high speed networks
  • real time
  • post processing
  • frame rate
  • low cost
  • reduction method
  • database
  • genetic algorithm
  • decision trees
  • preprocessing
  • defect detection
  • focal plane