Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging.
M. S. ParkS. L. GibbonsRaymundo ArróyavePublished in: Microelectron. Reliab. (2014)
Keyphrases
- electron microscopy
- mechanical properties
- prediction accuracy
- steady state
- data processing
- real time
- prediction error
- data sets
- learning phase
- high density
- boundary conditions
- information processing
- high speed
- video sequences
- human motion
- anisotropic diffusion
- experimental data
- medical images
- diffusion process
- artificial neural networks