Multilayer stacking technology using wafer-to-wafer stacked method.
Nobuaki MiyakawaEiri HashimotoTakanori MaebashiNatsuo NakamuraYutaka SachoShigeto NakayamaShinjiro ToyodaPublished in: ACM J. Emerg. Technol. Comput. Syst. (2008)
Keyphrases
- detection method
- support vector machine
- high accuracy
- objective function
- clustering method
- neural network
- preprocessing
- significant improvement
- computational cost
- classification method
- similarity measure
- optimization method
- machine learning methods
- high precision
- synthetic data
- support vector machine svm
- training samples
- theoretical analysis
- segmentation method
- test data
- computationally efficient
- experimental evaluation
- fully automatic
- dynamic programming
- combining multiple
- semiconductor manufacturing