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Modeling of substrate contacts in TSV-based 3D ICs.

Masayuki WatanabeMasa-Aki FukaseMasashi ImaiNanako NiiokaTetsuya KobayashiRosely KarelAtsushi Kurokawa
Published in: 3DIC (2014)
Keyphrases
  • preprocessing
  • real world
  • artificial intelligence
  • computer vision
  • feature selection
  • modeling method