PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system.
Katsuya KikuchiChihiro UedaFumiaki FujiiYutaka AkiyamaNaoya WatanabeYasuhiro KitamuraToshio GomyoToshikazu OkuboTetsuya KoyamaTadashi KamadaMasahiro AoyagiKanji OtsukaPublished in: 3DIC (2011)