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Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs.

Xin ZhaoMichael ScheuermannSung Kyu Lim
Published in: DAC (2012)
Keyphrases
  • quantitative analysis
  • high density
  • data analysis
  • statistical analysis
  • database
  • future development
  • data sets
  • databases
  • website
  • image analysis
  • high speed
  • integrity constraints
  • mathematical analysis