Wafer Thickness Sensor (WTS) for etch depth measurement of TSV.
David MarxDavid GrantRuss DudleyAndy RudackW. H. TehPublished in: 3DIC (2009)
Keyphrases
- manufacturing process
- data acquisition
- sensor data
- imaging sensors
- sensor networks
- time of flight
- depth map
- integrated circuit
- flow velocity
- microsoft kinect
- depth information
- sensor fusion
- fiber bragg grating
- real time
- multi sensor
- process control
- quality control
- data sets
- depth data
- sensory data
- production system
- data fusion
- light scattering
- mobile robot