Thermal via planning for temperature reduction in 3D ICs.

Jin-Tai Yan Yu-Cheng Chang Zhi-Wei Chen

Published in: SoCC (2010)

Keyphrases

high temperature
thermal imaging
thermal conductivity
air temperature
room temperature
infrared
heat transfer
stochastic domains
finite element analysis
planning problems
artificial intelligence
rough sets
data sets
mixed initiative
ai planning
multi agent systems
information systems
learning algorithm
data mining