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Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration.

Bui Thanh TungXiaojin ChengNaoya WatanabeFumiki KatoKatsuya KikuchiMasahiro Aoyagi
Published in: 3DIC (2014)
Keyphrases
  • hough transform
  • data mining
  • hypothesis testing
  • data fusion
  • thin film
  • real time
  • machine learning
  • information systems
  • decision making
  • clustering algorithm