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Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration.
Bui Thanh Tung
Xiaojin Cheng
Naoya Watanabe
Fumiki Kato
Katsuya Kikuchi
Masahiro Aoyagi
Published in:
3DIC (2014)
Keyphrases
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hough transform
data mining
hypothesis testing
data fusion
thin film
real time
machine learning
information systems
decision making
clustering algorithm