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Wangkun Jia
Publication Activity (10 Years)
Years Active: 2016-2022
Publications (10 Years): 3
Top Topics
Simulation Models
Probability Distribution
Reduced Order Model
Mathematical Models
Top Venues
CoRR
J. Comput. Sci.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
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Publications
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Wangkun Jia
,
Ming-C. Cheng
A methodology for thermal simulation of interconnects enabled by model reduction with material property variation.
J. Comput. Sci.
61 (2022)
Wangkun Jia
,
Ming-C. Cheng
A Methodology for Thermal Simulation of Interconnects Enabled by Model Reduction with Material Property Variation.
CoRR
(2021)
Wangkun Jia
,
Brian T. Helenbrook
,
Ming-C. Cheng
Fast Thermal Simulation of FinFET Circuits Based on a Multiblock Reduced-Order Model.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
35 (7) (2016)