A Methodology for Thermal Simulation of Interconnects Enabled by Model Reduction with Material Property Variation.
Wangkun JiaMing-C. ChengPublished in: CoRR (2021)
Keyphrases
- mathematical model
- conceptual model
- probabilistic model
- analytical model
- simulation model
- management system
- theoretical analysis
- image sequences
- simulation environment
- experimental data
- theoretical framework
- prior knowledge
- high level
- probability distribution
- network structure
- cost function
- formal model
- prediction model
- conceptual framework
- mathematical models
- objective function
- discrete event