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T. Bach
Publication Activity (10 Years)
Years Active: 2014-2014
Publications (10 Years): 0
Top Topics
Pairwise
Mechanical Properties
Failure Rate
Top Venues
Microelectron. Reliab.
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Publications
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Ning Duan
,
T. Bach
,
J. Shen
,
R. Rongen
Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses.
Microelectron. Reliab.
54 (9-10) (2014)