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Susnata Mondal
ORCID
Publication Activity (10 Years)
Years Active: 2018-2024
Publications (10 Years): 9
Top Topics
Fully Connected
Projector Camera
Test Driven Development
Multi Input Multi Output
Top Venues
ISSCC
IEEE J. Solid State Circuits
MobiCom
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Publications
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Susnata Mondal
,
Junyi Qiu
,
Sashank Krishnamurthy
,
Joe Kennedy
,
Soumya Bose
,
Tolga Acikalin
,
Shuhei Yamada
,
James E. Jaussi
,
Mozhgan Mansuri
18.2 A 4x64Gb/s NRZ 1.3pJ/b Co-Packaged and Fiber-Terminated 4-Ch VCSEL-Based Optical Transmitter.
ISSCC
(2024)
Susnata Mondal
,
Larry Richard Carley
,
Jeyanandh Paramesh
Dual-Band, Two-Layer Millimeter-Wave Transceiver for Hybrid MIMO Systems.
IEEE J. Solid State Circuits
57 (2) (2022)
Susnata Mondal
,
Jeyanandh Paramesh
Power-Efficient Design Techniques for mm-Wave Hybrid/Digital FDD/Full-Duplex MIMO Transceivers.
IEEE J. Solid State Circuits
55 (8) (2020)
Vaibhav Singh
,
Susnata Mondal
,
Akshay Gadre
,
Milind Srivastava
,
Jeyanandh Paramesh
,
Swarun Kumar
Millimeter-wave full duplex radios.
MobiCom
(2020)
Susnata Mondal
,
L. Richard Carley
,
Jeyanandh Paramesh
4.4 A 28/37GHz Scalable, Reconfigurable Multi-Layer Hybrid/Digital MIMO Transceiver for TDD/FDD and Full-Duplex Communication.
ISSCC
(2020)
Susnata Mondal
,
Rahul Singh
,
Jeyanandh Paramesh
A Reconfigurable Bidirectional 28/37/39GHz Front-End Supporting MIMO-TDD, Carrier Aggregation TDD and FDD/Full-Duplex with Self-Interference Cancellation in Digital and Fully Connected Hybrid Beamformers.
ISSCC
(2019)
Susnata Mondal
,
Jeyanandh Paramesh
A Reconfigurable 28-/37-GHz MMSE-Adaptive Hybrid-Beamforming Receiver for Carrier Aggregation and Multi-Standard MIMO Communication.
IEEE J. Solid State Circuits
54 (5) (2019)
Susnata Mondal
,
Rahul Singh
,
Jeyanandh Paramesh
A reconfigurable 28/37GHz hybrid-beamforming MIMO receiver with inter-band carrier aggregation and RF-domain LMS weight adaptation.
ISSCC
(2018)
Susnata Mondal
,
Rahul Singh
,
Ahmed I. Hussein
,
Jeyanandh Paramesh
A 25-30 GHz Fully-Connected Hybrid Beamforming Receiver for MIMO Communication.
IEEE J. Solid State Circuits
53 (5) (2018)