Sumant Sood

Publication Activity (10 Years)

Years Active: 2010-2010
Publications (10 Years): 0

Publications

Markus Gabriel, Thomas Knauer, Peter Bisson, Sumant Sood, Wilfried Bair, Jim Hermanowski
Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration. 3DIC (2010)
Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC (2010)