Mathias Nowottnick

Publication Activity (10 Years)

Years Active: 2011-2018
Publications (10 Years): 3

Top Topics

Power Electronics

Printed Circuit Boards

Diffusion Process

Top Venues

Microelectron. Reliab.

Period. Polytech. Electr. Eng. Comput. Sci.

Publications

Allen Jose George, Juergen Zipprich, Marlies Breitenbach, Markus Klingler, Mathias Nowottnick
Reliability investigation of large area solder joints in power electronics modules and its simulative representation. Microelectron. Reliab. (2018)
Dirk Seehase, Christian Kohlen, Arne Neiser, Andrej Novikov, Mathias Nowottnick
Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors. Period. Polytech. Electr. Eng. Comput. Sci. 62 (4) (2018)
D. Feil, T. Herberholz, M. Guyenot, Mathias Nowottnick
Highly variable Sn-Cu diffusion soldering process for high performance power electronics. Microelectron. Reliab. (2017)
Michael Fugger, Mathias Plappert, Carsten Schäffer, Oliver Humbel, Herbert Hutter, Herbert Danninger, Mathias Nowottnick
Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti. Microelectron. Reliab. 54 (11) (2014)
Mathias Plappert, Oliver Humbel, Angelika Koprowski, Mathias Nowottnick
Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy. Microelectron. Reliab. 52 (9-10) (2012)
Robert Neal Dean, Pradeep Lall, Mathias Nowottnick, William R. Harrell
Guest Editorial. IEEE Trans. Ind. Electron. 58 (7) (2011)